XI'AN QINLING DIAMOND GRINDING WHEEL CO.,LTD

manufacture(3)
manufacturing(1)

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disc special for sapphire finishing and polishing
Specification: 1A1/6A2 400-1200cm
Detail: Professional with rough grinding,finishing and polishing sapphire plan,now used the screen on the phone,watch and LED glass.high-efficiency,sharp cutting ,high-finish,keep the form better and long life.

back grinding wheel
Specification: 6A2 175/195/209/305/255/355
Detail: Back Grinding Wheel is mainly used in a Semiconductor Wafer Thinning and finishing.

led back thinning grinding wheel
Specification: 6A2 175/195/209/305/255/355
Detail: It is mainly used in LED Industry, for epitaxial the wafer of Sapphire substrate thinning.High-efficency thinning,high-finish,the quality of grinding wheel is stable

special for solar photovoltaic
Specification: 6A2T 200D-65T-130H-5-8W
Detail: It is mainly used in domestic and Japan Machine. It can be used in grinding side ,rounded for Silicon material and Polycrystalline Silicon.Replace the brush ,high-speed ,high- efficiency and high-finish grinding wheel.


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