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XI'AN QINLING DIAMOND GRINDING WHEEL CO.,LTD

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Showing 1 - 3 of 3, total 1 pages        [First] [Previous] [Next] [Last]

1
disc special for sapphire finishing and polishing
disc special for sapphire finishing and polishing
Specification: 1A1/6A2 400-1200cm
Detail: Professional with rough grinding,finishing and polishing sapphire plan,now used the screen on the phone,watch and LED glass.high-efficiency,sharp cutting ,high-finish,keep the form better and long life.

2
back grinding wheel
back grinding wheel
Specification: 6A2 175/195/209/305/255/355
Detail: Back Grinding Wheel is mainly used in a Semiconductor Wafer Thinning and finishing.

3
led back thinning grinding wheel
led back thinning grinding wheel
Specification: 6A2 175/195/209/305/255/355
Detail: It is mainly used in LED Industry, for epitaxial the wafer of Sapphire substrate thinning.High-efficency thinning,high-finish,the quality of grinding wheel is stable
Showing 1 - 3 of 3, total 1 pages        [First] [Previous] [Next] [Last]
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